Wednesday, June 8th 2022
AMD's Upcoming Zen 4 CPU Delidded by Overclocker
It appears that AMD's Zen 4 based CPUs are making their ways into the hands of overclockers and so far at least one has already been delidded. Although we only get to see the IHS itself, it's clearly very thick compared to what we've seen in the past, although it appears to be fairly straightforward to remove, if it wasn't for the fact that the two CCD's and the IOD are soldered to it. Unlike current CPUs, which have a solid seal, the Zen 4 CPUs appear to only have the IHS glued to the CPU packaging in a few spots.
Judging by the looks of the area where the CCDs and the IOD attach to the IHS, this looks like a destructive delidding, although it could just be leftovers from the soldering material. The IHS has clearly been coated with some materials for a good solder interface as well, but this is nothing new, as we've seen this on delidded, soldered CPUs in the past. The person who shared this picture should most likely not have done so and as such, we won't be posting a link to the source.
Judging by the looks of the area where the CCDs and the IOD attach to the IHS, this looks like a destructive delidding, although it could just be leftovers from the soldering material. The IHS has clearly been coated with some materials for a good solder interface as well, but this is nothing new, as we've seen this on delidded, soldered CPUs in the past. The person who shared this picture should most likely not have done so and as such, we won't be posting a link to the source.
85 Comments on AMD's Upcoming Zen 4 CPU Delidded by Overclocker
I get it, its probably for the better good, but im not a fan of the result. At all.
I guess these won't be easy to clean properly if someone makes a thermal paste mess.
What I don't get is how overclockers manage to get their hands on these CPUs so soon.I really hope this is just an engineering sample.
Having an extra-chunky IHS will also add to the thermal mass and make it easier to air-cool. I'm guessing LN2 and high-end water chillers will suffer, but that's such a tiny niche market that custom-build their own retention bracket and probably delid their CPUs anyway.
It's someone I know, but I don't want to post too many details.Most likely, as AMD hasn't finished their QS chips as yet, from what I understand.I guess we'll find out in due time.
AM5 has slightly less IHS surface area and a raised PPT of 230W so the thermal interface will play a larger role in the cooling performance.
In saying that, I am guessing that thermal paste will still play a relatively minor and insignificant part of cooling, where Conductonaut vs generic goop will provide no more than a few degrees.
I wonder if it's possible to build an effective and structurally sound one within those physical constraints, but it seems like a cool (hehe geddit) idea at least.